Compositions for dissipating heat

ABSTRACT

A heat dissipating shield comprises a layered configuration that mitigates damage to a surface coated with the shield. For example, the shield may comprise a sealant layer and a hydrated complex compound layer, such that the hydrated complex compound releases water vapor when the shield is exposed to heat. The water vapor may escape the shield without damaging the surface being protected by the shield.

FIELD OF THE INVENTION

This application relates to compositions capable of dissipating heat. Insome aspects, the composition comprises a shield that protects a surfacefrom heat exposure.

BACKGROUND

Heat dissipating compositions may be used in many applications. Forexample, they may be used to make shields that protect objects fromheat. These compositions may absorb directed energy in a chemicalreaction without significant increase in temperature, thus mitigating oravoiding a dramatic temperature increase that may be induced by a directheat source.

SUMMARY OF THE INVENTION

Aspects of the invention relate to a composition for dissipating heat.In some embodiments, the composition may comprise: a first layer formedfrom a compacted, hydrated, complex compound, wherein the first layerhas a front surface and a back surface, and a sealant applied to thefront surface of the first layer, wherein the sealant prevents vapordesorption from the hydrated complex compound until the composition issubjected to a heating event.

In another embodiment, the composition comprises a thermally conductivematerial disposed adjacent to the first layer. In some embodiments, thethermally conductive layer comprises copper or aluminum. The compositionmay comprise a second layer formed from the compacted, hydrated complexcompound disposed adjacent to the thermally conductive material. Thehydrated complex compound may comprise hydroxides or chlorides of alkalior alkali-earth metals or hydrated transition metal halides orhydroxides.

In yet another embodiment, the hydrated complex compound may compriseone or more metal salts or hydroxides, wherein the metal is selectedfrom the group consisting of alkali metal, alkaline earth metal,transition metal, or combinations thereof. The metal salts may compriseions selected from the group consisting of: halide, nitrite, nitrate,oxalate, perchlorate, sulfate, sulfite, or combinations thereof. Themetal salts may comprise one or more metals selected from the groupconsisting of: strontium, magnesium, manganese, iron, cobalt, calcium,barium, and lithium. In some embodiments, the hydrated complex compoundis hydrated with water. The hydrated complex compound may compriseLiOH.1H₂O, Sr(OH)₂.8H₂O, CaCl₂.1H₂O, SrCl₂.6H₂O or CaCl₂.2H₂O. Thehydrated complex compound may be bound to a fiber matrix. The fibermatrix may comprise woven, layered, or intertwined strands of fibers.The fiber matrix may comprise glass, polyamide, polyphenylene sulfide,polyparaphenylene terephthalamide, carbon or graphite fibers, orcombinations thereof.

In another embodiment, the sealant comprises a polymeric or rubbersealant. In another embodiment, the front surface comprises a reflectivematerial configured to reflect spectral frequencies in the range of 700nm to 2500 nm.

Another aspect of the invention relates to a heat dissipation panel. Insome embodiments, the panel may comprise a first layer formed from acompacted, hydrated, complex compound, a thermally conductive materialdisposed adjacent the first layer, and a second layer formed from thecompacted, hydrated complex compound and disposed adjacent to thethermally conductive material. In some embodiments, the thermallyconductive material comprises copper or aluminum.

In another embodiment, the panel may further comprise a sealant appliedto a front surface of the first layer, wherein the sealant preventsvapor desorption from the hydrated complex compound until thecomposition is subjected to heating event. In another embodiment, afront surface of the first layer comprises a reflective material. Thereflective material may be configured to reflect spectral frequencies inthe range of 700 nm to 2500 nm

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosed aspects will hereinafter be described in conjunction withthe appended drawings, provided to illustrate and not to limit thedisclosed aspects, wherein like designations denote like elements.

FIG. 1A illustrates a perspective view of an embodiment of a heatdissipating shield having a sealant layer and hydrate complex compoundlayer.

FIG. 1B illustrates a perspective view of an embodiment of a heatdissipating shield having a sealant layer, a hydrated complex compoundlayer, and a thermally conductive layer.

FIG. 1C illustrates a perspective view of an embodiment of a heatdissipating shield having a sealant layer, a thermally conductive layer,and a hydrated complex compound layer.

FIG. 2 illustrates a perspective view of an embodiment of a surface witha heat dissipating shield having a sealant layer, a reflective layer,hydrated complex compound layers, and a thermally conductive layer.

FIG. 3A illustrates a cross-sectional view of an embodiment of a surfacewith a heat dissipating shield having a sealant layer and a hydratedcomplex compound layer prior to heat exposure.

FIG. 3B illustrates a cross-sectional view of an embodiment of a surfacewith a heat dissipating shield having a sealant layer and a hydratedcomplex compound layer during heat exposure.

FIG. 3C illustrates a cross-sectional view of an embodiment of a surfacewith a heat dissipating shield having a sealant layer and a hydratedcomplex compound layer as a result of heat exposure.

FIG. 4A illustrates a perspective view of an embodiment of a heatdissipating shield protecting a surface.

FIG. 4B illustrates a cross-sectional view of the embodiment of FIG. 4A,along line 15, having a sealant layer, a hydrated complex compoundlayer, and a thermally conductive layer.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT I. Introduction

Embodiments of the invention relate to heat dissipating shields. Forexample, a heat dissipating composition may applied to any surface thatneeds to be protected from intense heat sources. In one embodiment, theheat dissipation composition may be imbedded within, or adjacent to, anarmor material to protect a surface. The heat dissipation compositionmay be an endothermic material. Upon exposure to heat from a heatsource, the composition may absorb the heat and generate water vapor,which is subsequently released from the shield. In this way, the heat isdissipated by the components of the shield rather than causing damage tothe protected surface.

II. Heat Dissipating Shields

Heat shields may protect a surface from damage from a heat source bydissipating, reflecting, or absorbing the heat. In this way, energy fromthe heat impacts the shield and minimizes impact to the protectedsurface. Fire, explosives, radiative heat, lasers, and heat guns areamong the heat sources that can damage a surface.

Heat from a heat source can cause a heating event on the surface of anobject resulting in fire, melting, or exploding of the object. Thiseffect may be exploited in the form of a weapon to inflict intentionaldamage to an object. Missiles, rockets, rocket motors, rotary andfixed-wing aircraft, drones, mortars, and other ground, sea, air, andspace-borne assets and facilities are among the objects that may beprone to damage from directed heat sources.

Heat sources with a capacity in the range of a few kilowatts to around100 kilowatts may be directed toward ground-based or low altitude targetobjects. Heat sources with a power density range of a few hundredkilowatts may reach target objects at a further distance, high altitude,or even beyond earth's atmosphere in space. Atmospheric conditions mayreduce the heat source intensity that reaches the target.

In addition, the target area of a surface that may be impacted by heatdepends on the focus of the heat source. When the heat source is a beamof light, targets that are further away result in a larger and lessfocused area, which may be referred to as the “bucket.” While lightsources with lower power levels may impact targets at distances of a fewmiles, light sources generating power in the multi-hundred-kilowattrange are expected to reach target objects at a distance of many miles.Light sources with power levels in the range of several hundredkilowatts may be capable of intercepting intercontinental ballisticmissiles.

If a light source makes contact with a target, the energy density on thesurface of the target may be between about 0.2 kJ/cm² and exceeding 1kJ/cm². Earlier systems with more limited power and beam focus maydeliver energy densities in the lower half of that range.

In one embodiment of the invention, a heat dissipating shield is used onthe outer surface of a target object and may employ a structure, such asceramic or high-tech fiber material that houses an endothermic compoundthat undergoes an endothermic reaction at a trigger temperature. In someembodiments, the shield also includes a reflecting finish that reflectsat least some of the source light. The endothermic compound may be madeup of a hydrated complex compound, an organic polymer with large waterabsorption capability or combinations of such materials.

Examples of hydrated complex compounds that may be used includehydroxides and chlorides of alkali or alkali-earth metals, such asLiOH.1H₂O, CaCl₂.1H₂O, CaCl₂.2H₂O, SrCl₂.6H₂O, Sr(OH)₂.8H₂O, or hydratedtransition metal halides or hydroxides. Water is one example of a usefulligand due to its high heat of desorption compared to other polar gasescapable of forming a complex compound. A more detailed description ofsuch materials as well as oxide-hydroxide reactions can be found in U.S.Pat. Nos. 8,361,618 and 8,302,416, incorporated herein by reference intheir entirety. The hydrated complex compounds may be compacted by avariety of means. For example, compacting may mean adding pressure to acomplex compound material sufficient to reduce voids in the material.The pressure may be mild enough to be created by a hand, or strongenough to require a mechanical or hydraulic press. Thus, as used herein,compacting may mean either pressed, melted, or pressed and melted toform a quasi-homogenous mass. In some embodiments, the hydrated complexcompounds may melt and/or release their stored water at differingtemperatures. For example, SrCl₂.6H₂O may melt at approximately 115degrees centigrade, but prior to reaching that temperature, become onlypartially hydrated by releasing stored water.

In some embodiments, the surface to be protected is that of a supersonicor hypersonic such as an airplane or missile. Objects traveling at thesespeeds may have surface temperatures exceeding 500 degrees centigradewhile in motion. For applications of this type, a metal hydroxidecompound may be included in the heat dissipating shield. Examples ofmetal hydroxides that can be used include NaOH, Ca(OH)₂, Sr(OH)₂,Al(OH)₃, Be(OH)₂, Co(OH)₂, Cu(OH)₂, Cm(OH)₃, Au(OH)₃, Fe(OH)₂, Hg(OH)₂,Ni(OH)₂, Sn(OH)_(s), and Zn(OH)₂.

Reflective materials may coat the surface to be protected. Reflectivematerials are selected to have maximum reflectivity at the lightfrequencies that may contact the material. For example, when the lightsource is a laser, reflectivity in the near infrared range of 700-2,500nm may be desirable. Silver, aluminum, and gold are examples ofreflective materials that may be used within embodiments of theinvention.

In order to increase the effectiveness of heat dissipating shields,thermally conductive materials such as high-thermal conductivity carbonor highly conductive metals such as copper or aluminum may be layered ontop of, beneath, or embedded into the heat shield's compound to increasethe chemical reaction mass reaching the trigger temperature.

The encapsulation of endothermic compounds bound to fibers is alsodescribed in the above-mentioned patents. However, encapsulation of theendothermic compounds within a substrate may not be necessary in allcircumstances as the thermal shield material itself may not be designedto provide mechanical armor. Removing the encapsulation materials fromthe structure of the heat shield will reduce weight and thereby increasethe thermal energy density of the heat shield.

In one embodiment, the heat shield is configured or designed to have aspecific trigger temperature at which the materials are activated toabsorb thermal energy. In order to obtain a trigger temperature betweenthe heat shield and applied heat, a sealant may be applied to thesurface that maintains a vapor or gas barrier, disabling the desorptionprocess until a certain temperature and therewith a certain pressure isreached.

The sealant may be selected to provide a differential pressure barrierthat, once exceeded, allows for the vapor stored within the heat shieldto escape, thus facilitating the desorption and thermal absorption.Typical trigger temperatures may be, for example, between 100-150degrees centigrade, or may be much higher, for example, in excess of 500degrees centigrade. Such temperatures are not reached during typicalstorage, transportation, or operation, but may be reached if extremeheat is applied to the heat shield. Embodiments of the heat shield mayalso include a sealant that undergoes chemical reactions at highertrigger temperatures, such as metal hydroxide to metal oxide reactions.

Example materials for the sealant may include any material that preventsstored water or other vapor within the heat shield composition fromescaping the substrate until the trigger temperature is reached.Suitable coating compositions include epoxy resin, phenolic resin,neoprene, vinyl polymers such as PBC, PBC vinyl acetate or vinyl butyralcopolymers, fluoroplastics such as polychlorotrifluoroethylene,polytetrafluoroethylene, FEP fluoroplastics, polyvinylidene fluoride,chlorinated rubber, and metal films including steel alloys, aluminum andzinc coatings. The aforesaid list is by way of example, and is notintended to be exhaustive. The coating may be applied to individuallayers of substrate, and/or to a plurality of layers or to the outer,exposed surfaces of a plurality or stack of substrate layers. Whendifferent sorbents are used each such composition is preferably sealedby sealant to avoid undesired migration of refrigerant from one sorbentto the other or mixing or displacement of one refrigerant with theother. In addition to these sealants, other sealants that provide somemechanical strength and protection of the underlying surface may also beused within embodiments of the invention.

For example, in one embodiment, the sealant is a porous fiber composite,or other composite material having pores that are configured to releasevapor once a trigger pressure is reached. Thus, a heat source may beapplied to the heat shield, which results in release of bound water fromthe shield material. Once the pressure of the released water vaporreaches a predetermined trigger pressure, the vapor is released throughthe pores of the composite sealant. The pressure difference across theporous composite that results in release of trapped vapor from the heatshield may be, for example, 0.1, 0.5, 1, 2, 5, or 10 atmospheres (atm)or more.

In another embodiment, the sealant could be a material that melts at atrigger temperature between about 100-150 degrees centigrade, allowingwater vapor to escape, and solidifying upon cooling. Paraffin and otherwaxes are examples of this type of sealant. Materials with highermelting points may be used for compounds that desorb at temperaturesabove 150 degrees centigrade, or even above 500 degrees centigrade.

Energy densities for hydrated complex compound or organic polymerdesorptions may be in the range of 0.8 kJ/g to over 2 kJ/g. Volumetricenergy densities including the structure housing the compound, thecompound itself, the sealant, and possible thermal conductivityenhancements may be on the order of 0.6 kJ/cm³ to a little over 1.2kJ/cm³ in one embodiment.

In one embodiment, the heat shield composition is cut, formed, rolled orpressed to form one or more layers of a desired size and/or shape. Eachlayer of material may be coated with a sealant composition capable ofpreventing the penetration of water vapor in the heat shield fromescaping out from the complex compound material and through the coatingat ambient/atmospheric temperature and pressure. Panels or other formsand geometries such as concave, convex or round shapes of the aforesaidcoated substrate composites such as laminates are formed to the desiredthickness. Moreover, such panels or laminates may also provide ballisticprotection in addition to thermal protection. Such dual-purpose panelsmay be installed in doors, sides, bottoms or tops of a vehicle, aroundammunition, sensitive cargo, etc. to provide such protection as well asthe above described cooling properties. Panels may also be shaped forother uses including personnel protection items and may be assembled inthe form of cases, cylinders, boxes or containers for protection ofordnance, explosives, rockets, missiles, directed energy, such as laserbeams or other material, fragile or sensitive items. Laminates mayinclude layers of steel or other ballistic resistant material such ascarbon fiber composites, boron carbide, aramid composites or metalalloys.

For penetration resistant vehicular armor, many different sized andshaped protection panels may be formed of the composite including floor,door, side and top panels as well as vehicle body components contouredin the shape of fenders, gas tank, engine and wheel protectors, hoods,and the like. As used herein, “vehicle” includes a variety of machines,including automobiles, tanks, trucks, helicopters, aircraft and thelike. Thus, the penetration resistant vehicle armor may be used toprotect the occupants or vital portions of any type of vehicle.

The aforesaid heat shield articles may also be combined with otherballistic and penetration resistant panels of various shapes and sizes.For example, the aforesaid heat shields may be paired with one or morelayers or panels of materials such as steel, aramid resins, carbon fibercomposites, boron carbide, or other such penetration resistant materialsknown to those skilled in the art including the use of two or more ofthe aforesaid materials, depending on the armor requirements of thepenetration resistant articles required.

III. Overview of Example Heat Dissipating Shields

FIG. 1A illustrates an embodiment of a heat shield 100 capable ofdissipating heat from heat source 102. As illustrated, the shield 100can include an upper sealant layer 104 disposed directly adjacent to ahydrated complex compound layer 106. The sealant layer may be made up ofany material that can seal stored water or other molecules in thehydrated complex compound layer 106 from escaping until a triggertemperature is reached. In the illustrated embodiment, the complexcompound layer 106 does not include a substrate, such as fiber, bound tothe complex compounds. Instead, the complex compound layer 106 wasformed by compression of the complex compound materials to form afree-standing composition that may be adhered to a surface needingthermal protection.

FIG. 1B illustrates an embodiment of heat shield 110 capable ofdissipating heat from heat source 112. As illustrated, the shield 110can include an upper sealant layer 114 directly adjacent to a hydratedcomplex compound layer 116. Below the hydrated complex compound layer116 is a thermal conductive layer, 118. In this example, the thermalconductive layer 118 is a copper layer, although other thermallyconductive materials such as aluminum are also contemplated. The thermalconductive layer is configured to spread any heat that is transferredinto the heat shield from one focused location to a broader surface ofthe shield. Thus, a focused source of heat, such as from a laser, wouldstrike the upper layers 114 and 116 of the heat shield and traversethough the composition until reaching the thermal transfer layer 118. Atthermal conductive layer 118, the heat from the laser would be conductedlaterally through the device 110 such that the heat is spread out acrossa larger surface area and not focused on a small, specific region. Thisspreading out of the thermal energy would allow the heat shield 110 toabsorb a relatively large amount of focused thermal energy and diffusethat energy through a broader area of the heat shield to help preventtoo much focused thermal energy from specifically contacting a protectedsurface.

FIG. 1C illustrates an embodiment of heat shield 120 capable ofdissipating heat from heat source 122. As illustrated, the shield 120can include an upper sealant layer 124 directly adjacent to a thermallyconductive layer 126. Below the thermally conductive layer 126 is ahydrated complex compound layer 128.

FIG. 2 illustrates a multi-layered heat shield 200 that includes a lowerprotected surface 212 that is coated with the heat shield compositionsin order to be capable of dissipating heat from a heat source. Asillustrated, the shield layers that are protecting the surface 212 caninclude an upper sealant layer 202 as described previously andconfigured to face a potential heat source. Below the sealant layer 202is a reflective surface 204. The reflective surface 204 is made fromaluminum in this example, although other reflective materials such asgold are also contemplated.

Located below the reflective surface is a first hydrated complexcompound layer 206. The first hydrated complex compound layer 206 ismade from a compressed formulation of LiOH.1H₂O in this example, andformed into a rectangular shape to match the shape of the protectedsurface 212. Of course, it should be realized that these components maybe formed in any desired shape.

Located below the first hydrated complex compound layer 206 is a thermalconductive layer 208. The thermal conductive layer 208 is disposedbelow, and in thermal contact with, the first hydrated complex compoundlayer 206. In this example, the thermal conductive layer 208 is a copperlayer, although other thermally conducted materials such as aluminum arealso contemplated. Disposed below the thermal conductive layer 208 is asecond hydrated complex compound layer 210. The first hydrated complexcompound layer 206 and the second hydrated complex compound layer 210may be made from the same materials or a different set of materials inorder to provide the desired heat dissipation characteristics for theheat shield 200. For example, the first hydrated complex compound layer206 may be formed from compressed LiOH.1H₂O and the second hydratedcomplex compound layer 210 may be formed from compressed CaCl₂.1H₂O.

Although the complex compound layers 206 and 210 are described ascompressed layers of hydrated complex compounds, it should be realizedthat they also may be made from layers of complex compounds that arebound to some type of substrate, such as a fiber strands. Furthermore,compression may be minimal and a combination of melt and compression maybe used to obtain the final configuration of the endothermic mass.

The substrate material of which the fiber strands are made includeglass, polyamide, polyphenylene sulfide, polyparaphenyleneterephthalamide, carbon, or graphite fibers. The glass fibers may beE-glass and/or S-glass, the latter having a higher tensile strength.Glass fiber fabrics are also available in many different weavingpatterns which also makes the glass fiber material a good candidate forthe composites. Carbon and/or graphite fiber strands may also be used.Polyamide materials or nylon polymer fiber strands are also useful,having good mechanical properties. Aromatic polyamide resins (aramidresin fiber strands, commercially available as Kevlar® and Nomex®) arealso useful. Yet another useful fiber strand material is made ofpolyphenylene sulfide, commercially available as Ryton®. Combinations oftwo or more of the aforesaid materials may be used in making up thesubstrate, with specific layered material selected to take advantage ofthe unique properties of each of them. The substrate material,preferably has an open volume of at least about 30%, and more preferablyabove 50%, up to about 95%. The specific substrate material selected andused as well as the percentage of open volume may depend on the expecteduses, including environmental exposure conditions, substrate meltingtemperatures, and the like.

The surface of the fibers and fiber strands of the aforesaid substratematerial are sufficiently polarized to at least provide some bondingbetween the fiber and the absorbent hydrated complex compound adequateto achieve the below loading densities. Polarized fibers are commonlypresent on commercially available fabrics, weaves or other aforesaidforms of the substrate. If not, the substrate may be treated to polarizethe fiber and strand surfaces. The surface polarization requirements ofthe fiber, whether provided on the substrate by a manufacturer, orwhether the fibers are treated for polarization, should achieve a targetloading density of the metal salt or hydroxide on the fiber. In oneexample, the loading density of hydrated complex compound is at leastabout 0.3 grams per cc of open substrate volume whereby the bonded metalcompound bridges at least some adjacent fiber and/or adjacent strands ofthe substrate.

Polarity of the substrate material may be readily determined byimmersing or otherwise treating the substrate with a solution of thesalt or hydroxide, drying the material and determining the weight of themetal compound polar bonded to the substrate. Alternatively, polarbonding may be determined by optically examining a sample of the driedsubstrate material and observing the extent of metal compound bridgingof adjacent fiber and/or strand surfaces. Even prior to such bondingdetermination, the substrate may be examined to see if excessive oil orlubricant is present on the surface. Oil coated material may negativelyaffect the ability of the substrate fiber surfaces to form an ionic,polar bond with a metal salt or metal hydroxide. If excessive surfaceoil is present, the substrate may be readily treated, for example, byheating the material to sufficient temperatures to burn off or evaporatemost or substantially all of the undesirable lubricant. Oil or lubricantmay also be removed by treating the substrate with a solvent, andthereafter suitably drying the material to remove the solvent anddissolved lubricant. Substrates may also be treated with polarizingliquids such as water, alcohol, inorganic acids, e.g., sulfuric acid.

FIG. 3A illustrates an embodiment 300 of surface 308 coated with ashield capable of dissipating heat from heat source 302, prior to heatfrom the heat source coming into contact with the shield. Asillustrated, the shield can include sealant layer 304 and a hydratedcomplex compound layer 306.

FIG. 3B illustrates an embodiment 310 of surface 318 coated with ashield capable of dissipating heat from heat source 312, while theshield is exposed to heat from the heat source. As illustrated, theshield can include sealant layer 314 and a hydrated complex compoundlayer 316. During heat exposure, vapor 320 generates pressure betweensealant layer 314 and hydrated complex compound layer 316. In thisexample, the vapor creates a cavity between the sealant layer and thehydrated complex compound layer. Of course, the vapor may form withinthe shield without causing any cavitation.

FIG. 3C illustrates an embodiment 322 of surface 330 coated with ashield capable of dissipating heat from heat source 324, after theshield is exposed to heat from the heat source. As illustrated, theshield can include a sealant layer 326 and hydrated complex compoundlayer 328. After heat exposure from the heat source, vapor 332 that wasgenerated during heat exposure may put pressure on sealant layer 326,causing the sealant layer to release the vapor through pores in thesealant layer, or alternatively rupture and allow the vapor to escape,as indicated by the arrow pointing away from the shield in FIG. 3C. Whenthe sealant is a wax, heat may cause it to melt, allowing vapor toescape through the melted wax. When the wax cools, it may re-solidifyinto a hardened sealant layer. In one embodiment, the sealant layer ischosen to have a predetermined pore size which is calculated to releasevapor when the pressure below the sealant layer reaches a predeterminedvalue.

FIG. 4A illustrates embodiment 400 of a cylindrical heat dissipatingshield protecting a surface. A cross-section of embodiment 400 alongline 410 is illustrated in FIG. 4B. As illustrated, protected surface408 is adjacent to thermally conductive layer 406. Hydrated complexcompound layer 404 completely coats thermally conductive layer 406.Outermost layer 402 is a sealant layer that completely coats hydratedcomplex compound layer 404.

It should be realized that the shield may be molded into any desiredshape or configuration to thermally protect a surface. For example, theshield may be molded into a cylindrical, conical, spherical, or othershape yet having the same configuration of specific layers as shown inthe Figures.

IV. Other Embodiments

Although discussed herein primarily in the context of heat dissipation,it will be appreciated that the compositions described above can beimplemented in a variety of other circumstances. The compositions canalso be implemented as body armor, for example as a protective layer fora person to wear while welding, glass-blowing or while participating inother activities that involve intense heat sources.

Features, materials, characteristics, or groups described in conjunctionwith a particular aspect, embodiment, or example are to be understood tobe applicable to any other aspect, embodiment or example describedherein unless incompatible therewith. All of the features disclosed inthis specification (including any accompanying claims, abstract anddrawings), and/or all of the steps of any method or process sodisclosed, may be combined in any combination, except combinations whereat least some of such features and/or steps are mutually exclusive. Theprotection is not restricted to the details of any foregoingembodiments. The protection extends to any novel one, or any novelcombination, of the features disclosed in this specification (includingany accompanying claims, abstract and drawings), or to any novel one, orany novel combination, of the steps of any method or process sodisclosed.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of protection. Indeed, the novel methods and systems describedherein may be embodied in a variety of other forms. Furthermore, variousomissions, substitutions and changes in the form of the methods andsystems described herein may be made. Those skilled in the art willappreciate that in some embodiments, the actual steps taken in theprocesses illustrated and/or disclosed may differ from those shown inthe figures. Depending on the embodiment, certain of the steps describedabove may be removed, others may be added. Furthermore, the features andattributes of the specific embodiments disclosed above may be combinedin different ways to form additional embodiments, all of which fallwithin the scope of the present disclosure.

Although the present disclosure includes certain embodiments, examplesand applications, it will be understood by those skilled in the art thatthe present disclosure extends beyond the specifically disclosedembodiments to other alternative embodiments and/or uses and obviousmodifications and equivalents thereof, including embodiments which donot provide all of the features and advantages set forth herein.Accordingly, the scope of the present disclosure is not intended to belimited by the specific disclosures of preferred embodiments herein, andmay be defined by claims as presented herein or as presented in thefuture.

What is claimed is:
 1. A composition for dissipating heat, comprising: afirst layer formed from a compacted, hydrated, complex compound, whereinthe first layer has a front surface and a back surface; and a sealantapplied to the front surface of the first layer, wherein the sealantprevents vapor desorption from the hydrated complex compound until thecomposition is subjected to a heating event.
 2. The composition of claim1, wherein the composition comprises a thermally conductive materialdisposed adjacent to the first layer.
 3. The composition of claim 2,wherein the thermally conductive layer comprises copper or aluminum. 4.The composition of claim 2, wherein the composition comprises a secondlayer formed from the compacted, hydrated complex compound disposedadjacent to the thermally conductive material.
 5. The composition ofclaim 1, wherein the hydrated complex compound comprises hydroxides orchlorides of alkali or alkali-earth metals or hydrated transition metalhalides or hydroxides.
 6. The composition of claim 1, wherein hydratedcomplex compound comprises one or more metal salts or hydroxides,wherein the metal is selected from the group consisting of alkali metal,alkaline earth metal, transition metal, or combinations thereof.
 7. Thecomposition of claim 6, wherein the metal salts comprise ions selectedfrom the group consisting of: halide, nitrite, nitrate, oxalate,perchlorate, sulfate, sulfite, or combinations thereof.
 8. Thecomposition of claim 7, wherein the metal salts comprise one or moremetals selected from the group consisting of: strontium, magnesium,manganese, iron, cobalt, calcium, barium, and lithium.
 9. Thecomposition of claim 1, wherein the hydrated complex compound comprisesLiOH.1H₂O, Sr(OH)₂.8H₂O, CaCl₂.1H₂O, SrCl₂.6H₂O or CaCl₂.2H₂O.
 10. Thecomposition of claim 1, wherein the hydrated complex compound comprisesa metal salt hydrated with water.
 11. The composition of claim 1,wherein the sealant comprises a polymeric or rubber sealant.
 12. Thecomposition of claim 1, wherein the front surface comprises a reflectivematerial configured to reflect spectral frequencies in the range of 700nm to 2500 nm.
 13. The composition of claim 1, wherein the compacted,hydrated, complex compound is bound to a fiber matrix.
 14. Thecomposition of claim 13, wherein the fiber matrix comprises woven,layered, or intertwined strands of fibers.
 15. The composition of claim13, wherein the fiber matrix comprises glass, polyamide, polyphenylenesulfide, carbon or graphite fibers, or combinations thereof.
 16. A heatdissipation panel, comprising: a first layer formed from a compacted,hydrated, complex compound; a thermally conductive material disposedadjacent the first layer; and a second layer formed from the compacted,hydrated complex compound and disposed adjacent to the thermallyconductive material.
 17. The heat dissipation panel of claim 16, furthercomprising a sealant applied to a front surface of the first layer,wherein the sealant prevents vapor desorption from the hydrated complexcompound until the composition is subjected to heating event.
 18. Theheat dissipation panel of claim 16, wherein the thermally conductivematerial comprises copper or aluminum.
 19. The heat dissipation panel ofclaim 16, wherein a front surface of the first layer comprises areflective material.
 20. The heat dissipation panel of claim 19, whereinthe reflective material is configured to reflect spectral frequencies inthe range of 700 nm to 2500 nm